System and method for attaching a substantially three dimensional structure to a substantially two dimensional structure

ABSTRACT

A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional structure is disclosed. A system and method for electrically coupling a three-dimensional structure to a substantially two dimensional structure is also disclosed.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to U.S. Provisional Application No.60/662,455, filed on Mar. 15, 2005, the disclosure of which isincorporated herein by reference in its entirety.

FIELD

This disclosure generally relates to attachment methods and moreparticularly to a method of soldering a substantially three dimensionalstructure to a substantially two dimensional structure. The threedimensional structure can be a medical catheter and the two dimensionalstructure can be a Printed Circuit Board. The three dimensionalstructures can transport different media such as electrical current,liquids, gases, and particulates.

BACKGROUND

Currently, electrical catheters consist of a hollow tube surroundingfine wires that are individually stripped, either by hand, by a laser,by bead blasting, by chemical etching, or various other methods, andterminated into bulky connectors and solder-cups. In an effort to reducethe size of the catheter, wires have been getting progressively smallerand smaller. As the wires get smaller they also become physicallyweaker. These weaker wires tend to break and become difficult to handleduring the assembly process required for high conductor count catheters.Large numbers of very thin conductors running axially along a catheterare also notorious for being un-flexible and have a tendency to gettangled, twisted, nicked, kinked, skived (exposing the electricalconductor), broken or get in the way of any guiding or steering wiresthat may be in operation, thus creating electrical shorts and opens.With an increase in the number of conductors, space limitation enhancesthe electrical issues. Assembly time also increases as more wires aremanually fed through the length of the catheter. Reworking and repairingthe catheters becomes time consuming, and, in some cases, impossiblewithout destroying the catheter.

A more desirable situation for modern catheters would be one thatincorporated a system for easy termination of an ever increasing numberof conductors and that allowed for quick, reliable, and or redundantsolder joints. Having a mechanical structure designed for flexibilitywould also aid in reducing field and assembly failures. Ideally, a newcatheter termination system would also enable a production operator toeasily switch between leaded and lead free solder without sacrificingproduction speed or capability.

SUMMARY

A method and system for transporting a fluid, gas, semi-solid, cryogen,or particulate matter, or combination thereof, between athree-dimensional structure and a substantially two-dimensionalstructure is disclosed. A system and method for electrically coupling athree-dimensional structure to a substantially two dimensional structureis also disclosed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an example system;

FIG. 2 is an expanded view of the example system of FIG. 1;

FIG. 3 is a side elevation view of the example system of FIG. 1;

FIG. 4 is a side elevation view of the example system of FIG. 1 withadditional electrical connectors;

FIG. 5 is a perspective view of a second example system;

FIG. 6 is a side elevation view of the example system of FIG. 5;

FIG. 7 is an expanded view of the example system of FIG. 5 with a fullystripped wire;

FIG. 8 is a side elevation view of a fully stripped wire;

FIG. 9 is an expanded view of the example system of FIG. 5 with apartially stripped wire;

FIG. 10 is a side elevation view of a partially stripped wire;

FIG. 11 is a perspective view of a third example system;

FIG. 12 is an expanded view of the example system of FIG. 11;

FIG. 13 is a side elevation view of a fourth example system;

FIG. 14 is a perspective view of a fifth example system;

FIG. 15 is an expanded view of the example system of FIG. 14;

FIG. 16 is a perspective, partially-transparent view of the examplesystem of FIG. 14 with three additional coils of elements;

FIG. 17 is a side elevation view of the example system of FIG. 14 withthree additional coils of elements;

FIG. 18 is an elevation view of a sixth example system;

FIG. 19 is a top-down view of the example system of FIG. 18;

FIG. 20 is a cross-sectional view of an example coil of elements;

FIG. 21 is a cross-sectional view of a second example coil of elements;

FIG. 22 is a cross-sectional view of a third example coil of elements;

FIG. 23 is a cross-sectional view of a fourth example coil of elements;

FIG. 24 is a cross-sectional view of a fifth example coil of elements;

FIG. 25 is a cross-sectional view of a sixth example coil of elements;

FIG. 26 is a cross-sectional view of a seventh example coil of elements;

FIG. 27 is a cross-sectional view of an eighth example coil of elements;

FIG. 28 is a cross-sectional view of a ninth example coil of elements;

FIG. 29 is a cross-sectional view of a tenth example coil of elements;

FIG. 30 is a cross-sectional view of an eleventh example coil ofelements;

FIG. 31 is a cross-sectional view of a twelfth example coil of elements;

FIG. 32 is a perspective view of a seventh example system;

FIG. 33 is an expanded perspective view of the system of FIG. 32;

FIG. 34 is a more closely expanded perspective view of the system ofFIG. 32;

FIG. 35 is a cross-sectional view of the system of FIG. 32;

FIG. 36 is a top-down view of an eighth example system;

FIG. 37 is an expanded, perspective view of the example system of FIG.36;

FIG. 38 is a cross-sectional view of the example system of FIG. 36;

FIG. 39 is a cross-sectional view of a ninth example system;

FIG. 40 is a cross-sectional view of a tenth example system;

FIG. 41 is a cross-sectional view of an eleventh example system;

FIG. 42 is a cross-sectional view of a twelfth example system;

FIG. 43 is a cross-sectional view of a thirteenth example system;

FIG. 44 is a cross-sectional view of a fourteenth example system;

FIG. 45 is a cross-sectional view of an example coil of elements for usein the system;

FIG. 46 is a cross-sectional view of a second example coil of elementsfor use in the system;

FIG. 47 is a transparent side elevation view of a third example coil ofelements for use in the system;

FIG. 48 is a transparent side elevation view of a fourth example coil ofelements for use in the system;

FIG. 49 is a side elevation view of a fifth example coil of elements foruse in the system;

FIG. 50 is a perspective view of a fifteenth example system;

FIG. 51 is a perspective view of a sixteenth example system;

FIG. 52 is a perspective view of a seventeenth example system;

FIG. 53 is a perspective view of an eighteenth example system;

FIG. 54 is a cross-sectional view of the example system of FIG. 52;

FIG. 55 is a cross-sectional view of the example system of FIG. 53;

FIG. 56 is a perspective view of a nineteenth example system;

FIG. 57 is a cross-sectional view of the nineteenth example system;

FIG. 58 is a perspective view of a twentieth example system; and

FIG. 59 is a side elevation view of the example system of FIG. 58.

DETAILED DESCRIPTION

A system for soldering a substantially three dimensional structure to asubstantially two dimensional substrate is described. An example of thesystem has a coil of elements and a substrate designed to receive thecoil. In some examples the coil lies in a groove formed on one of thesurfaces of a dielectric substrate, such as a printed circuit board(“PCB”). A connection pad or transfer point is disposed on a surface ofthe dielectric substrate and is designated to receive the coil. Theconnection pad is adjacent to the groove or the path of the coil suchthat a connection can be made between an element of the coil and theconnector pad. The coil element has a coating that is removed at thelocation of the connection between the coil and the connection pad.

Furthermore, the system can include a heat transfer pad in thermalcommunication with the connection pad in order to transfer heat to theelement and the connection material on the pad without physicallycontacting or contaminating the pad or the connection material.Typically, the coil of elements has multiple conductors wound thereinand the substrate has a plurality of connection pads or transfer pointsfor conductors in the coil. It is possible to vary the number ofconnection pads in order to provide redundant connections for safety andreliability or to allow for easier access to tightly coiled elements.The coil of elements may be wound around a hollow tube, wound over afiber optic element, or wrapped around any other suitable substrate. Theshape of the “coil structure” can be formed by any means. A sheath canalso cover the wires for further protection or aesthetic reasons.

The coil of elements can also have varying pitch to increase or decreasethe apparent rigidity and flexibility of the resultant system atpredetermined points without having to use different materials. Thischange of pitch also allows for the convenient locating of access pointsto the conductors contained in the coil and the dielectric substrate.This makes it easier to terminate each transfer point in this complexstructure.

Additionally, the system can include attachments to multiple dielectricsubstrates. The coil and the substrate can also be formed so that eachsubstrate will only interact with the coil in a predetermined locationand orientation. The coils of elements may also be used for structuralreinforcement of the system, which is especially useful when combinedwith pull wires or other such steering devices. Any given element withinthe coil need not be electrically conductive. The core of an element maybe dissolvable, and once dissolved, leave a hollow core element whichwould then be capable of carrying a variety of liquid, gaseous, orsemi-solid materials, or a combination of materials thereof.

A system for soldering a substantially three dimensional structure to asubstantially two dimensional substrate is described. An example of thesystem has a coil of elements and a substrate designed to receive thecoil. In some examples the coil lies in a groove formed on one of thesurfaces of a dielectric substrate, such as a printed circuit board(“PCB”). A connection pad or transfer point is disposed on a surface ofthe dielectric substrate and is designated to receive the coil. Theconnection pad is adjacent to the groove or the path of the coil suchthat a connection can be made between an element of the coil and theconnector pad. The coil element has a coating that is removed at thelocation of the connection between the coil and the connection pad.

Furthermore, the system can include a heat transfer pad in thermalcommunication with the connection pad in order to transfer heat to theelement and the connection material on the pad without physicallycontacting or contaminating the pad or the connection material.Typically, the coil of elements has multiple conductors wound thereinand the substrate has a plurality of connection pads or transfer pointsfor conductors in the coil. It is possible to vary the number ofconnection pads in order to provide redundant connections for safety andreliability or to allow for easier access to tightly coiled elements.The coil of elements may be wound around a hollow tube, wound over afiber optic element, or wrapped around any other suitable substrate. Theshape of the “coil structure” can be formed by any means. A sheath canalso cover the wires for further protection or aesthetic reasons.

The coil of elements can also have varying pitch to increase or decreasethe apparent rigidity and flexibility of the resultant system atpredetermined points without having to use different materials. Thischange of pitch also allows for the convenient locating of access pointsto the conductors contained in the coil and the dielectric substrate.This makes it easier to terminate each transfer point in this complexstructure.

Additionally, the system can include attachments to multiple dielectricsubstrates. The coil and the substrate can also be formed so that eachsubstrate will only interact with the coil in a predetermined locationand orientation. The coils of elements may also be used for structuralreinforcement of the system, which is especially useful when combinedwith pull wires or other such steering devices. Any given element withinthe coil need not be electrically conductive. The core of an element maybe dissolvable, and once dissolved, leave a hollow core element whichwould then be capable of carrying a variety of liquid, gaseous, orsemi-solid materials, or a combination of materials thereof.

FIGS. 1-4 depict an example system for electrically coupling a threedimensional structure to a substantially two dimensional structure. Thetwo dimensional structure is shown as a dielectric substrate 12 that hasa thickness. The thickness may be created by a single material or by thecombination of a series of substrates that are connected to one another.The three-dimensional structure is created by a coil of elements, whichin this case, is a coil of wires 14. The coil of wires 10 is positionedbetween an outer sheath 16 a and an inner sheath 16 b. In this example,the sheaths are shown as being transparent, flexible material.

The coil of elements 10 includes a plurality of wires 14 which arespaced one after another within the coil such that a first wire ispositioned adjacent a second wire which is positioned adjacent a thirdwire, etc. A coil of elements 10 is coupled to the dielectric substrate12 at connection points which are defined by a contact pad 20 andconnection solder 22. The contact pad 20 is a pad of conductive materialthat is positioned on a surface of a dielectric substrate 12. Thecontact pad could be recessed into the surface or could be positioned ontop of the surface. It could be created through plating or any otherknown means for attaching a conductive material to a dielectricsubstrate. Connection solder 22 is positioned on top of the contact pad.

In the example shown in FIGS. 1-4, four contact pads 20 are evenlyspaced around a mounting hole, which is a through-hole positioned in thedielectric substrate 12. Mounting hole 38 is a cylindrical hole having around cross-section and is sized and shaped to receive the coil ofelements 10 therethrough. The connection points are designed to coupleto the wires within the coil of elements to establish an electricalconnection between the contact pad and the associated wire. In order tocouple to the wires within the elements 10, the outer sheath 16 a of thecoil of elements is cut away in an area of the coil of elements 10 wherethe contact pad 20 can mate with a preselected wire 14. In addition, aprotective sheathing, such as a plastic coating, on the wire 14 is cutaway in the area of the contact pad 20.

Once the coil of elements 10 is positioned inside the mounting hole 38,a heating elements, not shown, can be applied to each contact pad 20 inorder to heat the solder 22 positioned thereon. When the contact pad 20is heated with the heating element, such as a soldering iron, the solder22 will flow to the wire and wick onto the wire 14, thereby establishingan electrical and mechanical connection between the solder contact padand the wire.

In FIG. 1, four wires 14 are shown positioned within the coil ofelements 10. The connection points on the dielectric substrate 12 arepositioned in order to mate with each one of the wires 14 on an uppersurface of the dielectric substrate. While the present example shows acylindrical coil of elements having four wires, it should be noted thatthe coil of elements could have any shape including cylindrical,rectangular, polygonal, oval, or any other type of shape that could bepositioned in a mounting hole. In addition, any number of wires and anynumber of connection points could be utilized in connection with thisexample, the example not being limited to the exact configuration shown.

FIG. 3 shows the coil of elements being connected to the dielectricsubstrate 12 along a top surface of the dielectric substrate. While FIG.4 depicts a similar example, but in this example, the coil of elements10 is coupled to both the top and bottom surfaces of the dielectricsubstrate 12. In this example, connection points are disposed on boththe top and bottom surfaces of the dielectric substrate 12. The outersheath 16 a of the coil of elements 10 has openings cut into the sheathsuch that wires within the coil of elements may be exposed forconnection to both the top and bottom surfaces of the dielectricsubstrate.

The example of FIG. 4 provides additional mechanical stability to thesystem by having the coil of elements coupled to the substrate 12 inmore than one plane. In addition, FIG. 4 provides for additionalelectrical connections between the wires 14 and the contact pads 20.This may provide protective redundancy within the system. In addition,it may allow electricity to travel from one point in a wire to anotheracross the substrate without requiring an additional via to bepositioned in the substrate. Lastly, as previously discussed, theconnection points or solder points between the coiled elements and thedielectric substrate assist in improving the mechanical strength of thesystem for electrically coupling the three-dimensional structure to asubstantially two-dimensional structure.

The two dimensional structure in these examples is the top surface ofthe dielectric substrate 12 or the bottom surface of the dielectricsubstrate 12. While the dielectric substrate 12 has a thickness suchthat it is actually a three-dimensional structure, the contact pad isconsidered the two-dimensional structure that the coil of elements 10 iscoupled to. The coil of elements 10 is the three-dimensional structurethat is being coupled to the two-dimensional structure of the substrate12. The word “substantially” is used herein to refer to thetwo-dimensional structure, which is the top surface of the dielectricsubstrate because it will be recognized that the contact pad and solderthemselves do provide more than a strict two-dimensional structure.However, the structure is substantially two-dimensional according to thedefinition of two-dimensional structure utilized herein.

FIG. 1 illustrates an exemplary method of attaching a coil of elements10 in the form of a tubular structure to a dielectric substrate 12. Itshould be understood that the tubular structure need not be round oreven hollow, as can be seen in FIGS. 22-31 described below. Connectionpads are disposed on the outer planar surfaces of the dielectricsubstrate. Each connection pad can optionally be in electricalcommunication or thermal communication with other structures on thedielectric substrate, such as electrical traces (not shown). Connectionmaterial rests on the top of the connection pads and can be either addedbefore the tubular structure or after the tubular structure is insertedinto the mounting hole 38. The connection pads are usually arranged in aradial pattern around the mounting hole 38. Once the tubular structurehas been inserted into the mounting hole 38, connection material 22bonds individual wires contained within the tubular structure toindividual connection pads on the dielectric substrate. This bonding isusually done through the use of heat from a heating element which can beeither a separate device or contained within the dielectric substrate.By attaching the tubular structure to the top and to the bottom of thedielectric substrate, a robust mechanical retention is generated at thesame time as electrical communication is established.

Generally, the tubular structure contains patterns of wire disposedbetween an inside layer and an outside layer. While the material of thetube provides for electrical isolation between various wires, each wirecan also be coated in an isolative material with a sheathing, orotherwise to either ensure or enhance the dielectric properties of thetube material. The dielectric materials covering any given wire willonly be removed to the minimum extent possible so as to maximize thestructural integrity of the tubular structure.

In the previously described examples of FIGS. 1-4, the coil of elementsincluded a series of wires that were cylindrically wound around theinner sheath 16 b of coil of elements 10. FIGS. 5 and 6 depict analternative example similar to the examples discussed in FIGS. 1-4.

In FIGS. 5 and 6, the coil of elements 10 includes an upper portion ofwires that are wound around an inner sheath 16 b, but at the point wherethe coil of elements is positioned in the mounting hole of thedielectric substrate 12, the wires 14 change direction and, instead ofbeing wound around the inner sheath 16 b, they longitudinally extendalong the length of the coil of elements between the inner sheath 16 band the outer sheath 16 a. The connection method previously described inconnection with FIG. 4 is utilized for connecting the wires to thecontact pads 20 with the connection solder 22. A hole 36 is cut in theouter sheath 16 a in order to allow the solder to couple to the wire 14that is positioned inside the sheath. The wire 14 is stripped of anyprotective material around the conductive portion of the wire 14. Ingeneral, the wire will have a plastic outer sheathing and either part,or all of this, protective plastic sheathing may be cutaway in thevicinity of the contact pad 20.

Generally, the tubular structure contains patterns of wire disposedbetween an inside layer and an outside layer. While the material of thetube provides for electrical isolation between various wires, each wirecan also be coated in an isolative material to either ensure or enhancethe dielectric properties of the tube material. Preferably thedielectric materials covering any given wire will only be removed to theminimum extent possible so as to maximize the structural integrity ofthe tubular structure. FIGS. 5-10 show some patterns and structures thataccomplish these goals.

Each method can be accomplished using a variety of techniques rangingfrom chemical etching to laser stripping to mechanical ablation. Manydifferent methods and patterns can be used, and the ones shown aremerely for illustrative purposes. Wires can be stripped axially eitherin strips or following the curve of the coil. Wires can be stripped suchthat the wires are hanging in free space. Wires can also be stripped sothat only a portion of their total inner core is exposed. There canexist multiple strip zones along the length of the tubular structure.Each zone can be of a different strip type and can expose only certainselected wires.

As shown in FIG. 6, the outer sheath 16 a may be cut at points that matewith both the top and bottom surfaces of the dielectric substrate 12. Aspreviously discussed in connection with FIG. 4, the use of connectionpoints on both the top and bottom surfaces of the dielectric substrate12 provides additional mechanical stability to the joint between thethree-dimensional structure of the coil of elements and thetwo-dimensional structure of the surface connection for the wire 14.

FIGS. 7-10 depict two examples of the way the protective sheathing maybe removed from a wire 14 such that the wire can couple to the solder22. In FIGS. 7 and 8, the wire 14 is stripped around the entirecircumference of the inner conductive core 40. The outer material,because it is not conductive, will not allow the wire to mate with thesolder. For this reason, it is necessary to strip the protectivesheathing of the wire. As shown in FIG. 7, the solder 22 on the contactpad 20 mates with the inner conductive material 40 of the wire 14. Inorder to establish both an electrical connection between the contact pad20 and the conductive material 40 of the wire 14 and a mechanicalconnection between the contact pad 20, solder 22 and wire 14 such thatthe wire is coupled to the top surface of the dielectric substrate 12.

FIGS. 9 and 10 are similar to FIGS. 7 and 8 except for, in this example,the wire is only stripped of the plastic outer sheathing on one side ofthe wire in the vicinity of the opening 36 that is cut in the outersheathing 16 a of the coil of elements 10. In this example, a window iscreated in the wire such that the conductive material of the wire 14 isexposed for connection to the connection solder 22. The method ofapplying the solder to the conductive member 40 of the wire 14 is thesame as that previously discussed in connection with FIGS. 1-4. Theheating element not shown may be applied to the contact pad 20 in orderto heat solder 22. Solder 22 then flows towards the conductive material40 of the wire 14 and wicks onto the conductive material 40 in order tocouple the solder 22 to the conductive material 40 of the wire 14,thereby establishing both an electrical and mechanical connection withthe wire 14.

FIGS. 11-12 show how the pattern of wires need not be coiled to still beeffective. Coiling the wires around a tubular structure allows for someadvantages though. Chief among them is that coiled wires are moreflexible and less prone to breaking then straight wires. This means thatthe flexibility and apparent durometer of any given tubular structurecan be changed from changing the coiled wires to straight wires, or justby changing the type of coil being used.

FIGS. 11 and 12 depict another example of a system for electricallycoupling a three-dimensional structure to assist a substantiallytwo-dimensional structure. In this example, the wires 40 of the coil ofelements extend axially along the length of the coil of elements. Thecoil in this example, is created by the combination of the outer andinner sheaths 16 a, 16 b. The wires 14 are not wound around the innercore 16 b. Instead, they extend axially between the inner and outersheaths 16 a, 16 b. The coil of elements 10 is again cylindrical andpositioned in a mounting hole 38 that is defined in a dielectricsubstrate 12. The dielectric substrate 12 includes contact pads 20 andconnection solder 22 positioned on each of the contact pads 20. The coilof element 10 is positioned through the hole and the dielectricsubstrate 12 and the wires of the coil of elements 10 are coupled to thecontact pads on the top surface of the dielectric substrate 12 accordingto any of the methods previously discussed. As with the prior examples,the outer sheath 16 a is cut away to form an opening 36 through whichthe solder 22 can communicate with the respective wire 14.

FIG. 12 shows a close-up of the connection between the solder 22 and theconductive material 40 of the wire 14. In this example, the plasticsheathing around the wire 14 has been removed around the circumferenceof the wire in the vicinity of the contact pad 20 and the holepositioned in the outer sheath of the coil of elements 10. FIG. 13 is anexample similar to the previously disclosed examples where the coil ofelements 10 comprises a plurality of wires 14 that are wound around aninner sheath 16 b. An outer sheath 16 a holds the wires 14 between theinner and outer sheaths to establish a cylindrical body which makes upthe coil of elements 10. In this example, three dielectric substratesare disclosed including a top dielectric substrate 12 a, a middledielectric substrate 12 b, and a lower dielectric substrate 12 c. Thewires 14 within the coil of elements 10 are coupled to the upper andlower surfaces of the dielectric substrates in the manner previouslydiscussed in connection with the prior examples. This includes the useof a conductive contact pad 20 disposed on a surface of the dielectricsubstrate with a connection solder being coupled to each contact pad 20.In addition, the coil of elements outer sheath 16 a has a hole 36 cutinto the sheath in the vicinity of each contact pad such that a wire 14within the coil of elements can be coupled to each of the contact padsvia the connection solder.

The example shown in FIG. 13 can be used for a system where a largenumber of wires are positioned in the coil of elements such that, forexample, each wire could be coupled to one or more of the substrates 12a, 12 b, 12 c, either one or more times. With a greater number of wires14, the number of connection points would be reduced since only alimited number of contact pads and connection solder are provided. Thisexample would allow for redundancy between the wire connections suchthat a single wire could be coupled to a dielectric substrate a numberof times. In addition, this example could be utilized to improve themechanical strength of the system because a greater number of solderjoints provides a greater mechanical strength and retention. Inaddition, this example could be utilized in order to couple a wire to avariety of different substrates. By coupling the wires to thesubstrates, additional vias and connectors can be avoided within thesystem.

FIG. 13 shows one example of multiple dielectric substrates disposedalong the length of a singular tubular structure. Each dielectricsubstrate can be used either singly or it can be in electricalcommunication with another dielectric substrate. Having multiplesubstrates allows for an increase in mechanical alignment for thetubular structure, as well as an increase in the available area forconnection pads in high wire count coils.

FIGS. 14-17 depict an alternative example of the system for electricallycoupling a three-dimensional structure to a substantiallytwo-dimensional structure. In this example, the dielectric substrate 12includes a plurality of holes or passageways 38 in the form of cut-outson the corners of the dielectric substrate 12. Instead of having thehole 38 disposed through the center of the dielectric substrate 12, inthis example, the dielectric substrate has the corners cut out and thecoil of elements is positioned partially into one of the corners. Whilethis example shows a part of the coil of elements being inserted intothe openings 38 in the dielectric substrate 12, the size and shape ofthe coil of elements and the size and shape of the dielectric substrateand the holes of the dielectric substrate could be modified such that agreater proportion of the coil of elements is positioned within thecorner passageway or hole of the dielectric substrate 12, the examplenot being limited to the depicted dimensional characteristics. While inthe prior examples, the contact pads were disposed around a circularhole in the dielectric substrate. In this example, the contact pads 20are disposed around the cutaway opening in the corners of the dielectricsubstrate 12. In this example, the cutaways in the dielectric substrate12 are arcuate such that the contact pads are spaced along the edge ofthe arcuate opening for connection with a coil of elements positionedadjacent the arcuate opening. The coil of elements 10 includes aplurality of wires 14 that extend axially along the length of the coilof elements 10 between the inner 16 b and outer 16 a sheaths of the coilof elements 10.

As shown in FIG. 15, the wires 14 may be stripped of their plastic outersheathing to reveal the conductive material 40 of the wires 14 and thisconductive material 40 may be coupled to each contact pad in the mannerpreviously described in the prior examples by melting a solder 22disposed on each contact pad 20 such that the solder 22 wicks onto eachwire and establishes electrical communication and mechanicalcommunication between the solder 22 and the conductive portion 40 of thewires 14.

FIGS. 16 and 17 shows views of how a plurality of coil of elements 10may be connected to the dielectric substrate that has the corners cutout to form corner passageways. In the examples shown in FIGS. 16 and17, four coils of elements are coupled to the dielectric substrate, withone coil being positioned in each arcuate opening on the corners of thedielectric substrate 12. Each coil of elements 10 includes wires thatextend axially along the length of the coil of elements 10 and the wiresmay be joined to the contact pads 20 in a manner previously discussed inconnection with FIG. 15. The use of the dielectric substrate 20 to jointhe four coils of elements 10 together helps to provide mechanicalstability between the four coils of elements. While not shown, the coilsof elements may be joined to both an upper and a lower surface of thedielectric substrate, if so desired. While the coil of elements in thisexample is shown as including axially extending wires 14, it should berecognized by those skilled in the art that the coil of elements couldinclude wires that are wound around the inner sheath 16 b instead oflongitudinally or axially extending wires as shown in the figures.

FIGS. 14-17 show a similar arrangement of dialectic substrates as thatshown in FIG. 13. However, instead of the tubular structure passingthrough the core of a dielectric substrate, the tubular structure passesthough an edge of the dielectric substrate. Such an arrangement wouldallow for easier integration in compact clamshell type hand pieces aseach dielectric substrate would have only a portion of the tubularstructure to interact with at any given time. It is also easy to addmultiple tubular structures to a single dielectric substrate when thetubular structures are disposed at the edges of the dielectricsubstrate.

FIGS. 18 and 19 depict an alternative example of the system forelectrically coupling a three-dimensional structure to a substantiallytwo-dimensional structure. In this example, the dielectric substrate 12does not have a through-hole 38, or holes positioned on the corners oranywhere else on the dielectric substrate 12. In this example, the coilof elements terminates at the top surface of the dielectric substrate.Thus, the wires 14 that are positioned at the end of the bundle of wiresof the coil of elements 10 terminate at the contact pads 20 establishedon the upper surface of the dielectric substrate 12. Similar to thepreviously described examples, the coil of elements 10 includes aplurality of wires that are wound around an inner sheath 16 b andconstrained by an outer sheath 16 a. The coil of elements is cylindricaland the dielectric substrate is shown as rectangular, however, anyshapes for either of these elements may be utilized, if so desired. Theouter sheath 16 a includes a cutaway portion 36 where the wire 14 iscoupled to the respective contact pad 20 utilizing connection solder 22.In the depicted examples in FIGS. 18 and 19, four contact pads areutilized to couple to four wires that are disposed within the coil ofelements. Each contact pad is positioned on the dielectric substratesuch that it connects a different wire to each contact pad 20. Theconnection solder may be coupled to each wire 14 via heating of thesolder such that it wicks onto the conductive portion of each wire 14 toestablish an electrical and mechanical connection between the contactpad and the wire 14.

It is possible to terminate the coils of wire contained within thetubular structure at locations other than along the length of thetubular structure. FIGS. 18-19 illustrate just such a terminationwherein the dielectric substrate is disposed at an end of the tubularstructure. End attached terminations can be combined with any and all ofthe above described termination methods.

FIGS. 20-31 depict several different examples of a wire structure withina coil of elements 10. As shown in FIG. 20, a coil of elements having acircular cross-section includes an inner sheath 16 b and an outer sheath16 a. A plurality of wires 14 are disposed between the inner and outersheaths. FIG. 20 is similar to the examples previously disclosed. Thewires may be wound around the inner sheath or the wires may be axiallyextending along the length of the coil of elements.

The tubular structure need not have a round cross-section. FIGS. 20-31demonstrates a representative subset of the possible cross sections of atubular structure. Tubular structures can have any number of differenttypes of cross-sections such as round (FIGS. 20-22), oval (FIGS. 29-31),square (FIGS. 26-28), rectangular, pentagonal, triangular (FIGS. 23-25),or other shapes. Tubular structures can also contain not just onecentral lumen, but a plurality of lumens of different sizes andconfigurations. What they all have in common is that a pattern of wiresexists around the inside of the outer perimeter of the tubularstructure. Sheath—outer 16 a, inner sheath 16 b.

FIG. 21 depicts a coil of elements having a round cross-section, similarto that of FIG. 21, except for, in this example, two different sizes ofwires are provided. In this example, coil of elements has an innersheath 16 b and an outer sheath 16 a with a first-sized wire 14 a evenlyspaced around the circumference of the coil with an equal number oflarger conduits 14 b or wires positioned between each of the smallerconduits or wires 14 a. In this example, the different shaped wires 14a, 14 b may be used for different functions. For example, 14 a isrepresentative of a wire, while 14 b is representative of a conduit ortube having a dissolvable center such that fluid can be transportedthrough the center of the conduits 14 b. Alternatively, wires could bepositioned in either 14 a and 14 b and fluid could be positioned in 14a, if so desired. Although not previously discussed, the present systemmay be utilized to establish both electrical connections and fluidconnections. In each of the previously disclosed examples, the wirescould alternatively be channels, tubes, or other conduits fortransporting a fluidic material including liquids, gases, or other suchmaterials. In the case where fluid is transported through the wires 14,the dielectric substrate 12 would have an associated conduit channel orother feature for receiving the fluid in a fluid type manner. This willbe discussed in greater detail below. However, as shown in FIG. 21, itis possible to have both fluid transporting conduits and wires withinthe coil of elements 10.

FIG. 22 depicts an alternative example where an outer sheath 16 a isprovided with two inner sheaths 16 b. The inner sheaths 16 b defineopenings within the coil of elements 10 that extend axially along thelength of the coil of elements. In the depicted example of FIG. 22, theinner sheaths define two cylindrical openings that extend axially withinthe coil of elements. Wires 14 a may be positioned around the peripheryof the coil of elements adjacent the outer sheath 16 a.

FIGS. 23-25 depict alternative examples similar to those previouslydiscussed, except that in this case the coil of elements is triangularin shape. The coil of elements is bounded on the outside by sheath 16 aand on the inside by sheaths 16 b and 16 c. The plurality of wires aredisposed around the periphery of the coil of elements, and the wires maybe either wound around the coil of elements or disposed axially alongthe length of the coil of elements 10.

FIG. 24 depicts a triangular coil of elements 10 having an inner sheath16 b and an outer sheath 16 a with a plurality of wires disposed betweenthe inner and outer sheaths. In this example, the wires 14 a are evenlydistributed around the periphery of the coil of elements. As with priorexamples, the wires 14 a may be wound around the circumference of theinner sheath 16 b or the wires 14 may extend axially along the length ofthe coil of elements 10.

FIG. 25 depicts a similar triangular coil of elements 10 having an innersheath 16 b and an outer sheath 16 a. A plurality of wires are disposedaround the coil of elements. A smaller wire 14 a is disposed around anoutermost periphery of the coil of elements and an inner larger wire isequally spaced around the inner sheath 16 b. There are more wires 14 athan wires 14 b. Although this example is discussed in the context ofwires within the coil of elements 10, it should be recognized that theelements 14 a and 14 b could be either wires or conduits or passagewaysfor receiving a fluid, such as liquids or gases.

FIGS. 26-28 depict an alternative example of the coil of elements 10where the outer periphery of the coil of elements is substantiallyrectangular. In the depicted examples in FIGS. 26-28, the coil ofelements 10 is a square shape. FIG. 26 includes an outer sheath 16 a andan inner sheath 16 b. A plurality of wires 14 a are equally spacedaround the periphery of the coil of elements between the inner and outersheaths 16 a, 16 b.

FIG. 26 depicts a square outer sheath 16 a. Two inner sheaths 16 b aredefined as circular tubes or cylinders that extend through the interiorof the coil of elements. One of the inner sheaths has a larger diameterthan the outer inner sheath. A plurality of wires 14 a are disposedinside the outer sheath 16 a and evenly spaced around the periphery ofthe coil of elements 10.

FIG. 28 depicts a coil of elements 10 having an outer sheath 16 a thatis square in shape and an inner sheath 16 b that is a similar squareshape. A plurality of wires are positioned between the inner and outersheaths. The wires include smaller diameter wires 14 a that arepositioned nearest to the outer sheath 16 a and a plurality of innerlarger diameter wires 14 b that are spaced around the inner sheaths. Theinner wires 14 b are fewer in number than the outer wires 14 a, and eachof the wires are evenly spaced around the periphery of the coil ofelements 10.

As previously discussed in connection with prior examples, the elementsdescribed as wires 14 a and 14 b in FIGS. 26-28 could alternatively beconduits or passageways for transporting a fluid such as a gas or aliquid. The examples are not to be limited to simply wires havingelectrical connectors disposed therethrough. The wires 4 couldalternatively be plastic coated tubes having a dissolvable materialinside the tubes is dissolved, a conduit for a fluid is provided.

FIGS. 29-31 depict an alternative example of a coil of elements 10similar in many respects to the examples previously discussed. Each ofthe examples in FIGS. 29-31 has an oval shaped outer periphery. FIG. 29includes an inner sheath 16 b and an outer sheath 16 a which togetherbound an interior space having a plurality of wires disposed therein.The plurality of wires 14 a are evenly spaced around the peripheryaround the coil of elements 10. The wires may be wound around the innersheath or may be axially extending along the length of the coil ofelements.

FIG. 30 depicts an inner sheath 16 b and an outer sheath 16 a with aplurality of wires disposed between the inner an outer peripheries andevenly spaced around the periphery thereof. In this example, the twodifferent sized wires are provided. A smaller diameter wire is evenlyspaced around the outer periphery of the coil of elements adjacent theouter sheath 16 a. An inner plurality of wires 14 b, having a largerdiameter than the outer wires 14 a, are disposed adjacent the innersheath 16 b. The smaller wires 14 a are far more numerous than thelarger wires 14 b in this example coil of elements 10. FIG. 31 disclosesan outer sheath 16 a and two inner sheaths 16 b. A plurality of wires 14are disposed between the inner and outer sheaths 16 b, 16 a.

The inner sheaths 16 b form cylinders having a circular cross-sectionthat extend axially along the length of the coil of elements 10. One ofthe inner sheaths forms a larger diameter circle than the outer innersheath, which forms a smaller diameter circle than the larger diametercircle. The plurality of wires is disposed around the outer edge of thecoil of elements adjacent the outer sheath 16 a. In this example, onlyone diameter wire is disclosed, however, it should be recognized in anyof these examples, that any number of wires and any size wires may beutilized to the extent that they fit within the area between the innerand outer sheaths 16 a, 16 b. Also, as previously discussed, while theabove description was in the context of wires 14, which typically willhave a conductive material positioned within an outer plastic coating,the wires may alternatively be tubes for transporting a fluid such as agas or a liquid.

FIG. 32 depicts an alternative example of the system for electricallycoupling a three-dimensional structure to a substantiallytwo-dimensional structure. In this example, a coil of elements 10 isdisposed within a recess or passageway that is defined in the surface ofsubstrate 12. While prior examples positioned the coil of elementsperpendicular to the dielectric substrate 12, in this example, the axisof the coil of elements is substantially perpendicular to the surface ofthe dielectric substrate 12. A recess 38 is defined within a surface ofthe dielectric substrate 12 in order to receive at least a portion ofthe coil of elements therein. The coil of elements 10 is depicted asseating in the recess 38 and such that part of the coil of elements ispositioned below the surface of the dielectric substrate and part of thecoil of elements 10 as positioned above the surface of the dielectricsubstrate 12. It will be recognized that any shape of opening or recessin the dielectric substrate could be utilized such that the coil ofelements is positioned at different depth levels of the dielectricsubstrate. The position of the coil of elements relative to thedielectric substrate 12 is, in part, dependent upon the thickness of thedielectric substrate 12.

The coil of elements 10 includes an inner sheath and an outer sheathwith the inner sheath serving as a boundary for a spirally woundplurality of wires that are positioned between the inner and outersheets 16 b, 16 a. The wires of the coil of elements 10 are coupled tocontact pads having solder 22 disposed thereon in a manner similar tothat previously discussed in connection with the prior examples. Theonly difference is that the coil of elements is positioned on its sideinstead of being straight up and down. In this example, the outer sheathis cut to expose the wires inside the coil of elements and eachrespective wire that is to be coupled to a contact pad is also strippedof its protective outer coating in order to reveal the underlyingconductive material within the wire. As previously discussed, inconnection with the prior examples, solder position on the contact pad,upon heating, couples to the conductive material 40 within each wire 14that is aligned for coupling.

The dielectric substrate 32 in this example shows electrical traces 103that extend from the contact pads to other components. The example shownin FIG. 32 also incorporates heat transfer pad that is conductivelycoupled to the contact pads 20. The heat transfer pad is designed toaccept heat from a heating element, to transfer the heat to the contactpad which then melts the solder 22 that is positioned on the contactpad, such that the solder wicks or couples to an adjoining wire withinthe coil of elements 10. The heating pad may be spaced from the contactpad by a conductive conduit which is essentially a pad of conductivematerial that is coupled to the heat transfer pad and to the contactpad. A secondary dielectric may be positioned over the conductiveconduit such that communication between the heating pad and the contactpad is avoided. The heating pad is also a conductive element that ispositioned on a surface of the dielectric substrate 12. Alternatively,the elements referred to as “heating pads” may be connector holes forreceiving a connector for coupling to the wire. The holes 110 on theleft side of the dielectric substrate 12 may be utilized for positioningconnector therein or for coupling to a pin or other similar connector.

FIG. 33 is a expanded view of the connection between the wires 14 andthe contact pad 20 of the example shown in FIG. 32. In this figure, theouter sheath 16 a of the coil of elements 10 is cut away in the vicinityof the wires to be coupled to the contact pads disposed on thedielectric substrate 12. The protective coating of the wires may befully stripped in the vicinity of the opening in the outer sheath, inorder to allow the wires to be coupled to the connection solder 22. Aswith prior examples, the wires may be joined to the connection solder.

In FIG. 33, the longitudinal axis of the coil elements 10 issubstantially perpendicular to the surface of the dielectric substrate12. Depending upon the thickness of the dielectric substrate and thediameter of the coil of elements 10, the longitudinal axis of the coilof elements 10 could align with the surface of the substrate or bepositioned above or below the surface of the substrate. The solderconnection for FIG. 33 includes a contact pad 20 having a solder 22disposed thereon. A heating pad of conductive material is coupled to thecontact pad 20 by a conductive conduit 21. The heating pad has disposedthereon a heat transfer material such that when the heat transfermaterial of the heating pad comes in contact with a heat source, theheat is transmitted from the heat transfer pad through the conductiveconduit to the contact pad which then heats the solder disposed on thecontact pad. The solder then wicks onto the exposed wire in the vicinityof the solder to establish an electrical and mechanical connectionbetween the contact pad and the wire.

FIG. 34 depicts an example of how wires are numbered within a coil ofwires. In this example, a first wire is coupled to the first contactpad, a second wire is coupled to the last contact pad, a third wire iscoupled to the third contact pad, and a fourth wire is coupled to thethird contact pad. A similar set of contact pad is disposed on the leftside of the coil of elements 10. Depending upon the pitch of the wiresin the coil of elements 10, the wires 1 through 4 will be arranged in asimilar scheme on the left side of the coil of elements, or a differentarrangement. For example, the wire connections on the left side of thecoil of elements on the dielectric substrate could be arranged innumerical order starting with 1 through 4. Or, the numbers could beswitched around depending upon the pitch of the windings of the wires inthe coil of elements 10.

FIG. 34 illustrates a method of soldering a substantially threedimensional structure to a substantially two dimensional structure.Specifically, a three dimensional coil 10 of wound wire or wires 14 a-14c is attached to a substrate 12 with the use of a connection material 22displaced on a connection pad 20 which has been permanently affixed tothe substrate 12 and can be easily defined in terms of length and width.The coil 10 can be used in a medical device such as a probe that isinserted into the human body but the current invention is not solimited. The coil 10 need not have a constant cross section for itsentire length, indeed the coil can expand and contract at predeterminedpoints along its length independent of the tubular structure. The coil10 can surround a hollow tube, solid tube, guide wire, optical fiber,cavity, etc. All of these structures are hereafter referred to as atubular structure 16 which will be discussed in detail below. Ingeneral, a tubular structure contains an outer surface 16 a and an innersurface 16 b and the wires 14 are contained within the tubular structure16.

FIG. 35 shows a cross section of the coil 10, the wires 14, thesubstrate 12, as well as connection material 22, conductive material103, connection pads 20, and heat transfer pads 24 along a common,arbitrary plane. During the wetting of the wire 14 by the connectionmaterial 22, the connection material 22 wraps around the wire 14 forminga good mechanical joint at the interface of the groove 18 and theconnection pad 20.

FIGS. 36, 37 and 38 illustrate another way to attach a substantiallythree dimensional structure to a substantially two dimensional substrate12. Each wire 14 is wound around a tubular structure 16 that is placedwithin a groove 18 of a substrate 12. Connection pads 20 are disposedalong a planar surface of the substrate 12 at the spacing of the wires14. Specifically, when tubular structure 16 is laid in the groove 18,each wire 14 intersects the substrate 12 at multiple locations. Contactpads 20 are applied to the substrate 12 at those locations where thewire 14 intersects the substrate 12 and connection material 22 isapplied to the top surface of all the connection pads 20.

FIGS. 39 through 44 depict alternative examples of the connectionbetween the coil of elements 10 and the opening 38 disposed in thedielectric substrate 12. In FIG. 39, the channel that is positioned inthe top surface of the dielectric substrate for receiving the coil ofelements 10 has a rectangular cross-section. As shown, a side of thecoil of elements is positioned at the bottom of the rectangular recess38. In this example, the longitudinal axis of the coil of elements issubstantially aligned with the surface of the dielectric substrate 12.Connection solder 22 is utilized to connect wires within the coil ofelements to respective contact pads on the surface of the dielectricsubstrate 12.

FIG. 40 depicts and alternative example of a recess 38 in the surface ofthe dielectric substrate 12 that is V-shaped such that two sides of thecoil of elements 10 rests upon the two sides of the V-shaped channel 38.Connection solder 22 is utilized to couple wires disposed within thecoil of elements to contact pads that are disposed on the surface of thedielectric substrate 12. As with FIG. 39, the longitudinal axis of thecoil of elements 10 is substantially aligned with the surface of thedielectric substrate 12.

FIG. 41 depicts a coil of elements positioned between two dielectricsubstrates 12. A horizontal axis of the dielectric substrates 12 alignswith the longitudinal axis of the coil of elements 10. The dielectricsubstrates have a height that is less than the diameter of the coil ofelements 10. As such, when the coil of elements 10 is positioned betweenthe dielectric substrates 12, a portion of the coil of elements 10extends above the top surfaces of the dielectric substrates and aportion of the coil of elements 10 extends below the bottom surface ofthe dielectric substrate 12. Connection solder is utilized on both thetop and bottom surfaces of the dielectric substrates to couple theconductive wires 14 of the coil of elements to the contact pad that aredisposed on the surfaces of the dielectric substrates.

FIGS. 42 through 44 depict a coil of elements that is positioned on thetop surface of the dielectric substrate. In these examples, a recess forretaining the coil of elements is created by the connection solder thatis utilized to connect the contact pads to the conductive elements orwires within the coil of elements 10. No recess 38 is defined in thesurface of the dielectric substrates 12.

FIG. 42 depicts and oval coil of elements wherein the long transverseaxis of the oval is positioned parallel to the surface of the dielectricsubstrate 12. The connection solder 22 is positioned substantially underthe edges of the coil of elements.

FIG. 43 depicts an oval-shaped coil of elements where the longtransverse axis of the oval shape is positioned perpendicular to thesurface of the dielectric substrate 12. The oval shape is held on thedielectric substrate by the connection solder 22, which forms supportsfor the coil of elements 10. The connection solder 22 is positioned onthe contact pads and a portion of the connection solder is positionedunder the edges of the coil of elements 10 and a portion of theconnection solder 22 extends outwardly from the edges of the coil ofelements 10.

FIG. 44 depicts a coil of elements having a cross-sectional shape likethat of a racetrack. A long transverse axis of the coil of elements isdisposed parallel to the surface of the dielectric substrate 12.Connection solder is positioned on the contact pads and is coupled tothe wires of the coil of elements 10 in order to establish an electricaland mechanical connection between the wires and the contact pad. Theconnection solder 22 supports the coil of elements on the surface of thedielectric substrate 12. FIGS. 45 through 49 depict different examplesof tubular structures that contain coils of wire. The wires in thisexample can be moving in opposite directions such as clockwise andcounterclockwise. The alternating coils form braided or woven structuresalong the length of the tubular structure.

FIGS. 32-44 show how it is not necessary for the tubular structure andthe dielectric to be arranged perpendicularly to one another by using achannel or a groove that has been formed into the surface of adielectric substrate, the tubular structure can be mechanically retainedby attachment to connection pads. With the correct profile of a tubularstructure, having the channel on a dielectric substrate is not evenrequired, but instead the tubular structure can have a flat side whichrests flush with the dielectric substrate (not shown).

FIG. 45 shows an example where the wires are braided on the surface ofthe tubular structure with one wire going in a first direction and theother wire going in a second direction. FIG. 45 depicts two or morewires disposed around a tubular structure with some of the wires goingin a first direction and some of the wires going in an oppositedirection. FIG. 46 is similar to FIG. 45, but includes a wire 41 a thatextends longitudinally along the length of the tubular structure. FIG.47 depicts two wires disposed around the surface of a tubular structurewith the windings of the wires having different pitches depending uponthe location of the wires along the length of the tubular structure.FIG. 48 is similar to FIG. 47 except for it only includes a single wiretraveling in a single direction. The wire has a different pitch at theone end than at the other end. FIG. 49 represents a winding of wiresaround the tubular structure. The windings have a different pitch at oneend and at the other, the pitch gradually changes between the one endand the other end.

FIGS. 45-49 show how the coil of wire can be combined with otherstructures inside or alongside the tubular structure. The coil cancontain wires moving in opposing directions, i.e. clockwise andcounterclockwise turns. These alternating coils can interact with eachother and form woven or braided structures along the length of thetubular structure. Not all of the individual wires contained within sucha braided structure need to be electrically conductive or attached to adielectric substrate. Selective stripping of the insulation allows forprecise control over what is attached to what. Indeed, straight runs ofwire (not shown) can be combined with either the braided structure orwith regular coils of wire. These straight runs can be for eitherselective impedance matching, electrical attachment, or asnon-conductive safety wires. It is also not necessary for all thestrands in a coil to be of the same size or of the same material. Forexample, thermocouple pairs can be run down within the coil of wire andmixed gauge wires can be used to both further refine the flexibilitycharacteristics of the tubular structure and to enhance the electricalcommunication of the system.

FIGS. 50-55 represent a fluidic structure that is configured to acceptfluids, gases or semi-fluid or particulate matter transfer. The termconductive element as used herein in connection with the coil of wires10 is defined to include both electrical transmission and fluidictransmission of an element, such as a fluid, a gas, a cryogen, aparticulate, and a semi-solid. As previously discussed, the wires 14 mayalternatively be tubes that are filled with a dissolvable material suchthat when the material inside the tube is dissolved, a hollow member fortransporting the fluid is provided. In order to connect such a hollowmember containing a dissolvable material to a substrate, the covering ofthe dissolvable material within the tube may be stripped at a locationwhere the tube is to be connected with a substrate, such as a dielectricsubstrate 12 depicted in FIG. 50. Alternatively, the tube can bepositioned adjacent a channel opening in a substrate 12 withoutstripping.

Once the protective material around the dissolvable material is strippedaway, leaving the dissolvable material, an epoxy or other plastic typeof sealing material may be positioned over the dissolvable material todefine a conduit through which a fluid can flow once the dissolvablematerial has been dissolved. As shown in FIGS. 50-55, a channel 106 isdisposed in a substrate 12 and the tube 14 is in communication with thatconduit 106. A temporary gusset 105 is disposed adjacent the tube ofdissolvable material and is utilized to hold the tube in place and toseal around the tube to create the channel from the tube to the channelthat is defined within the substrate. The tube filled with dissolvablematerial is coupled to the channels 106 that is defined in thesubstrate. In addition, The example coil of elements can include both aconductive wires and tubes filled with dissolvable material. Gusset 105can be an epoxy-type sealing material, or other material that can beused to seal the tube of dissolvable material to a corresponding conduitin the substrate 12. The electrical connections and fluidic connectioncan be used side-by-side on a single substrate, can be used on differentlayers of a substrate either together alone, can be used on differentsubstrates that are coupled to a single or multiple coils of elements10.

FIG. 50 shows a substrate 12 with a coil 10 disposed therein. Thesubstrate 12 has channels 106 formed inside and filled with a removablematerial. On the surface of the substrate 12 are contact pads 20 whichare also made of a removable material. Selected wires 14 within the coil10 are filled with a removable material and have stripped areas 36 whichexpose the removable material.

FIG. 51 depicts a removable connection material 22 between the wirecores 40 and connection pads 20. The connection material 22 forms partof the mechanical envelope of the transfer passage 107. In FIG. 52,attachment material 105 is added between the tubular structure 16 andthe substrate 12 in order to mechanically restrain the coil 10 and toform the other part of the mechanical envelop of the transfer passage107.

In FIG. 53, the removable material is removed from the system. Thisleaves hollow channels 106 inside the substrate, a hollow transferpassage 107 and hollow wires or tubes 14 in the coil 10. In FIG. 54, asection view through one of the connection pads 20 shows a section ofthe channel 106 in the substrate 12 being filled with a removablematerial and another removable material forming a transfer passageprofile and a third removable material inside the wire 14. Thus the pathfrom the coil 10 to the substrate 12 is clearly shown. In FIG. 55, asection view through one of the connection pads 20 shows a section ofthe system after all the removable material has been removed. Thisleaves transfer passage 107 empty and allows for the flow of materialthere through.

Any given wire with a coil may also contain a dissolvable core. Thisallows for a very low cost way of integrating massively multi lumencatheters with electrical connections. Such a system is shown in FIGS.50-55. The tubular structure shows only a single wire for clarity but itis to be understood that a plurality of wires can also exist within sucha system. The wire is then stripped of its insulation but left mostlyintact both in the containing insulation and in the tubular wallstructure. The stripped wire portion is then aligned on the dielectricsubstrate over the connection pad and a temporary gusset 105 is formedbetween the wire core and the contact pad. The contact pad and gussetmaterial are also formed out of dissolvable material such that when thematerial is removed, a channel 106 will exist between the dielectricsubstrate and the tube within the tubular structure. Before the gussetand associated materials are dissolved, a final covering material isused to completely encapsulate the original gusset and retain thetubular structure. The channel inside the dielectric substrate can alsobe easily attached to a micro-fluidic controller or some other suchsystem. With the material removed; fluids, particulates, gasses,cryogens, and combinations thereof can flow from the tip of the catheterdown to the dielectric substrate and vice versa. This allows foractivities like drug delivery, blood sampling, and other importantactivities.

Dissolvable Cores to Create Transfer Passages: Transfer Passages are thefluid equivalent of a solder joint. They are a passageway extending fromthe stripped and opened center of the tube disposed in a helical fashionaround the body of the catheter to the opening over the channels insidethe 2 D structure.

Any given conductor within a coil may also contain a dissolvable core.This allows for a very low cost way of integrating multi lumen tubes orcoils combined with electrical connections. Such a system is shown inFIGS. 50-55. The tubular structure shows only a single wire for claritybut it is to be understood that a plurality of wires can also existwithin such a system.

The wire is firstly partially stripped of its insulation both in regardsto the wire insulation and the tubular structure wall as described indetail above. The stripped wire is then aligned on the substrate over acontact pad and a temporary deposit of dissolvable material is placed inposition to create a core connecting the tube of the 3 D structure tothe channel in the 2 D Structure over which the transfer passage isformed. The contact pad, selected portions of the substrate, and thetransfer passage core material are also formed out of dissolvablematerial of either the same or of differing types than that found withinthe wire core.

When the material is dissolved, a hollow transfer passage is formedbetween the channel in the substrate and the hollow lumen within thetubular structure. Thus a transport system is formed from the microfluidic channel or channels contained in the substantially 2D structurecontinuously through to the tubes or lumens in the wall of the 3Dstructure.

Before the positive transfer passage and other associated materials aredissolved, a final covering material is used to completely encapsulatethe original transfer passage core material which seals and mechanicallyretains the tubular structure.

The channels thus formed inside the substrate can be easily attached tomicro fluidic controllers, reagent cavities or can be routed to moremacro scale tubing systems, hydraulics, or other such system. After thecore of such a wire has been dissolved, the remaining tubular structurescan be used with micro fluidic devices to allow for reagent mixing, drugdelivery, blood sampling, saline delivery, drainage, controlledcryogenic delivery and extraction, as well as a number of other uses.With the material removed; semi-solids, particulates, fluids, cryogens,gasses, and combinations thereof can flow from the tip of the 3D tubularstructure down to the 2D dielectric substrate and vice versa.

Minimally invasive surgical procedures rely on being able to do a lot ofwork while causing the patient less pain, scarring, and lower therecovery time. This is commonly done by making a small artificialincision and feeding a tube up through the incision and having all ofthe instrumentation needed fed up through the tube. Modern cathetersfeed wires up through the body of the tube to tips on the catheterswhich can be used to diagnose and treat a multitude of disorders. Asbeing able to go home directly after a surgical procedure is consideredmore desirable then long hospital stays, there is an ever growing demandfor new procedures and hence for new micro medical devices. Designersare working at a cross purpose though; in order to create a lesstraumatic experience a smaller catheter body is desired, but to allowfor more complex procedures, more wires are needed inside the catheter,pushing for larger catheter bodies. Catheter bodies are not always roundand are not always tubes. Ovoid shapes are very popular as they allowfor easier bending in certain directions which makes steering thecatheter easier in certain situations. Catheters can also contain anumber of different “tubes” or lumens that have been all formed at thesame time. Typically, certain lumens are used to carry wires and otherlumens are used to carry fluids.

Fluid transportation is useful for a variety of reasons. One reason isfor drainage, much like what a dentist does with excess saliva exceptintegrated into the same tool being used to clean your teeth. Anotherreason is for sampling of whatever the tip is interacting with, so youcould have real time localized blood oxygen content readings as well asmeasuring what other chemicals are present in the blood stream duringsurgery. Tubes can also be used to push material into the area as wellas to take materials away from the area. Saline, being both neutral tothe body and conductive, is often used during ablation procedures. Drugscan also be delivered along the same channels and allow for veryspecific targeting of problem sites.

Cryogens can also be sent up the tube to freeze off a very small portionof the body. Many people have warts frozen off from external body partsbecause it is a very effective method of killing off a localized area ina way that the body quickly repairs. Being able to freeze interiorportions of bodily anatomy could easily revolutionize current cancertreatments.

Instead of running wires inside of a tubular structure as separateelements, we have developed a method of integrating the wires into thevery structure of the tube. Moving the wires into the tube wall frees upthe lumens for other purposes. Having wires run parallel to the axis ofthe tubular structure may be easier to manufacture, but it presentsdifficulties in that it tends to make the resulting tubular structuremore rigid. By wrapping the wires around the tubular structure in a coilor a more helical pattern, flexibility can be increased and subsequentwork hardening of the wires is greatly reduced. Varying the patternallows for different levels of stiffness or rigidity at different pointsalong a tubular structure, in effect replacing complex multi durometertubular structures. Helical coils also allow for some interestingtermination options. Fiber optics can be split, with only minimal impacton signal integrity by matching up helical tangents on two differenttubular structures. Helixes will also eventually cause all theconductors in a system to pass through a single tangent line parallel tothe axis of the tubular structure, thus allowing for easy attachment ofmultiple wires to a single line on a single substrate. This also allowsfor adding in electrical connections to devices and structures thatwould otherwise not contain them. For example wires could be wrappedaround a fiber optic element. Though separately insulated wires are easyto incorporate, it is also easy to use flex circuits or otherwise addedconductive material, by such common processes as sputtering, to theoutside of a tubular structure.

Tubular structures need not apply only to medical catheters. Tubularstructures are used in everything from avionics to architecture. Beingable to have a high density interconnection system that still allows forstructural rigidity and or allows for other devices to share the samespace is of great use in a variety of industries. For example, airplanescould move most of their wiring harnesses to the skin of the airframeusing our techniques. Also power conduits and network connections couldrun up a central structural member of a new building and could use thenew Medconx technology to run high density backbones between floors.

FIGS. 56 and 57 depict an alternative example where the coil of elementsis sandwiched between two dielectric substrates 12. In this example, aswith the prior examples, the coil of elements 10 can be coupled tosurfaces on both dielectric substrates 12. As shown in FIG. 57, the coilof elements is coupled to the lower dielectric substrate utilizingretention solder positioned on a contact pad. In addition, a heattransfer pad for thermally communicating with the contact pad andconnection solder is disclosed. In addition, the coil of elements iscoupled to the upper dielectric substrate on the bottom surface thereofin a similar manner. Both substrates include a recess 38 for receivingat least a portion of the coil of elements therein. FIGS. 56-57 showanother example of how a single tubular structure can connect tomultiple dielectric substrates.

FIGS. 58 and 59 disclose an example similar to that in FIGS. 11 and 12,except for the coil of elements in FIGS. 58 and 59 is positioned at anangle relative to the surface of the dielectric substrate 12. The holeor passageway 38 that is defined through the dielectric substrate issimilarly angled such that the coil of elements is able to rest withinthe hole that is defined in the dielectric substrate 12. The coil ofelements can be positioned at any angle relative to the surface of thedielectric substrate including a 45° angle, a 60° angle, 80° angle orperpendicular to the dielectric substrate 12 among other angles, thedisclosure not being limited to a particular angle of the coil ofelements 10 and relative to the surface of the dielectric substrate 12.The connections between the wires 14 of the coil of elements and thecontact pads and connection solder disposed on the surface of thedielectric substrate are similar to that previously discussed inconnection with FIGS. 11 and 12.

FIGS. 58-59 illustrate the advantage to the mounting hole not beingperpendicular to the dielectric substrate. As the tubular structure andthe dielectric substrate depart from a right angle, the connectionmaterial is placed more and more in shear when axial load is placed onthe tubular structure, thus increasing the overall strength of theadhesion between the dielectric substrate and the tubular structure.

FIGS. 60-61 show how multiple substrates can be laminated together, eachwith their own connection pads disposed around a common mounting hole,and contact a tubular structure. This allows for easy integration ofsoldered and non-soldered joints in a very compact environment. Multiplesubstrates can be laminated together; each with their own connectionpads disposed around a common mounting hole, and contacting wires withina tubular structure. In one example, the connection pads are formed fromconductive layers similar to those found in common multilayered printedcircuit board substrates. Regardless of the substrate used, theconnection pads all have connection material disposed along an edgethereof using a variety of reflow methods. The wires within the tubularstructure are then selectively stripped of their insulation and insertedwithin the hole. Optionally, the tube is press fit into the hole foradded mechanical retention. Once inserted, the contact pads are heated,either through resistive heating between another contact point along thewire and the contact pad or through other heating methods, and theconnection material melts and attaches to the wire core in a mannersimilar to the ones described above.

The substrate 12 can be prepared by forming a groove 38 in a planarsurface of the substrate 12. The groove 38 is sized and configured toreceive a portion of the coil 10 along its axial length. Conductivematerial 103 is applied to the planar surface of the substrate 12 duringthe initial manufacture of the substrate 12 at a spacing that matches aneven increment of the wires 14 within the coil 10. The conductivematerial forms a plurality of connection pads 20 which are usuallydisposed perpendicularly to the axis of the groove 18 and abut the edgeof the groove 18. Each connection pad 20 may be surrounded by asecondary dielectric 100 in order to prevent connection material 22 fromflowing over the surface of the substrate 12 in an uncontrolled manner.The connection material 22 is added on top of connection pad 20 toenable the electrical and mechanical joining of the substrate 12 to thewire 14 and hence mechanically retain the coil 10 and allow forelectrical communication between a distal end of the coil 10 and thesubstrate 12. The connection material 22 is added before the coil isintroduced but after the formation of the groove 18 but the connectionmaterial 22 can also be added at the same time as the coil 10 is alignedinside the groove 18 with the connection pads 20. Also, the connectionmaterial 22 would be added in an automated manner, such as with a solderstencil and reflow process standard to the electronics industry.

The coil 10 is prepared by removing portions of the tubular structure 16in the area where the wires 14 a-14 c are to be soldered to thesubstrate 12. Furthermore, each wire 14 that is to be attached has someof its insulation removed at that location. Wires 14 can be strippedusing a laser cutting or other technique such as but not limited tothermal ablation, chemical etching, and bead blasting. Both the tubularstructure 16 and the wire insulation are ideally removed at the sametime and only in the locations needed to attach a wire 14 to aconnection pad 20. The wire 14 can be tinned, before or after theinsulation is removed, with a coating of connection material 22 tofacilitate attaching the wire 14 to a connection pad 20.

In order to attach the coil 10 to a substrate 12, the coil 10 is placedwithin a groove 18 and each wire 14 to be affixed is aligned with arespective connection pad 20. Because the conductive material 103 wasplaced at an even increment of the pitch of the wires 14, only a singlewire 14 has to be aligned with a pre-determined connection pad 20 andall other wires 14 will be aligned with their respective connection pads20. This saves time during assembly and eases the process of solderingmultiple wires 14 to a substrate 12.

Each stripped wire 14 is attached to a respective connection pad 20 withan individual connection material 22. Specifically, a heat source isplaced in thermal communication with connection pad 20. The heat thentravels through the connection material and is transferred to the wire14. The connection material 22 then wicks up the heated wire 14 forminga joint between a connection pad 20 and the wire 14. Once the thermalcommunication is taken away, the connection material 22 hardens thussecuring the wire 14 to the connection pad 20 and hence to the substrate12 and any other components or structures that may be in electricalcommunication with the underlying conductive material 103.

Additionally, it is possible to attach wire 14 to connection pad 20using a heat transfer technique. In this instance, the heat from a givensource, typically a soldering iron, is applied to a heat transfer pad 24which is in thermal communication with a connection pad 20. The heattransfer pad 24 is in communication with the contact pad 20 such thatconnection material 22 can be melted without physical contact from theoriginal heat source. A secondary dielectric 100 may be placed betweenthe heat transfer pad 24 and the connection pad 20 in order to preventthe cross contamination with the connection material 22 disposed on thesurface of the connection pad 20. A secondary bump of connectionmaterial 22 can be added on top of the heat transfer pad 24 to aid inthe thermal communication between a heat source and the heat transferpad 24 and hence between a heat source and the connection material 22and from there to the wire 14.

Discontinuous Structures: By using a process that adds wires or othersuch conductive elements selectively, it is possible to have wires goonly partway down a tubular structure. This means that there can bearbitrary segments of the tubular structure that contain a differentnumber of wires then other portions. It is also possible to run all thewires down the length of the tubular structure but to cut otherwisesplice certain wires at a given point, effectively turning a single wireinto two electrically separate pieces. Having a different number ofwires means that the apparent flexibility of the system can be furtherrefined. However, a more ingenious use of the system is to add in a“backplane” type interconnect system between multiple substratesattached to the coil. Not only does such a backplane, or perhaps moreproperly a “frontplane”, drastically simplify routing difficulties, butit can also lower the cost of the substrates by allowing for fewerinterlayer connections or vias. Each wire in the frontplane can be usedto carry a different type of information. Electrical signals, lightimpulses, power connections, fluid samples, gaseous reagents, and manyothers can be moved from substrate to substrate, either individually oren masse, and from any given substrate to locations further down thetubular structure.

An optional method of attaching the wires 14 in a coil 10 to a substrate12 that allows for redundancy for safety, mechanical stability, and anincreased coil density while simultaneously easing the assembly processis seen in FIG. 34. Each instance of conductive material 103 is labeledeither “1”, “2”, “3” or “4” for ease of illustration. It can be seenthat wire 14 d is aligned and attached to connection pad 20 a, wire 14 cis aligned and attached to connection pad 20 b, wire 14 b is aligned andattached with connection pad 20 c, and wire 14 a is aligned and attachedwith connection pad 20 d. Each of the labels then shows and identifieseach wire 14 from the coil 10 as a separate joint and makes it easy toidentify. It will be recognized by those of ordinary skill in the art,that any wire 14 can be soldered to the substrate 12 at multiplelocations using the techniques described herein and that any number ofwires 14 can be attached to a substrate 12 with these techniques.

A method is disclosed for transporting a fluid, gas, semi-solid,cryogen, or particulate matter between a three dimensional structure anda substantially two dimensional structure. The method includes a step ofproviding a hollow member having a removable material disposed therein.The hollow member is associated with a three-dimensional structureassociated with an electrically conductive element, a fluidicallyconductive element, or a combination thereof. Another step entailsassociating the hollow member with a hollow transfer passage of asubstantially two-dimensional structure. Another step entails coveringthe hollow member, and at least one of the two-dimensional structure andthe three-dimensional structure with a substance. Yet another stepentails removing the removable material to define a passage incommunication with the hollow transfer passage of the substantiallytwo-dimensional structure and the hollow member of the three-dimensionalstructure.

The method may further include removing part of the hollow member toexpose the removable material before applying the substance. It furtherincludes associating the exposed removable material of the hollow memberto the hollow transfer passage of a substantially two-dimensionalstructure, wherein the substance is utilized to cover the exposedremovable material to define a passage between the hollow member and thehollow transfer passage.

The substantially two-dimensional structure is coupled to one or moredielectric substrates, with a fluid passage defined through thedielectric substrates in communication with the hollow transfer passage.A fluid, gas, semi-solid, cryogen, or particulate matter is transportedfrom the hollow member, through the substance, through the hollowtransfer passage, to the fluid passage.

A system for transporting a fluid, gas, semi-solid, cryogen, orparticulate and for establishing a fluidic or hollow connection betweentwo structures includes the following: A three dimensional structure hasa plurality of conductive elements associated therewith, the conductiveelements each having a channel for transporting materials therealong. Aremovable material is disposed within the channel of the conductiveelements and coupled to the substantially two-dimensional structure, theremovable material being covered with a substance such that when thematerial is removed, a hollow transfer passage is defined. The substancemechanically connects one of the conductive passageways in thesubstantially two-dimensional structure to the passageways in thethree-dimensional structure.

The two-dimensional structure can contain multiple layers for thetransfer of multiple media and materials. The three dimensionalstructure further includes conductive elements that have a conductivemember disposed therein for establishing an electrical connection withthe two-dimensional structure.

A system for electrically coupling a three dimensional structure to asubstantially two-dimensional structure includes a three-dimensionalconductive structure and a substantially two-dimensional conductivestructure. It further includes a means for electrically coupling thesubstantially two dimensional conductive structure to thethree-dimensional conductive structure along an attached section whilemaintaining flexibility of the attached section and promoting mechanicalretention of the three dimensional structure to the two dimensionalstructure.

The three-dimensional conductive structure is tubular and thetwo-dimensional structure has a passageway defined therein for acceptingat least part of the three-dimensional conductive structure.

A system for electrically coupling a three dimensional structure to asubstantially two-dimensional structure includes a tubular coil ofconductive elements that are selectively electrically isolated from oneanother. A dielectric substrate is sized and shaped to come intoproximity with at least a portion of the tubular coil. A connection padhas a connection material disposed thereon positioned on the dielectricsubstrate. The connection material is for coupling the conductiveelements to the dielectric substrate.

The connection pad may be a conductive contact pad coupled to a surfaceof the dielectric substrate and the connection material is a thermallyactivated conductive connection material for coupling a conductiveelement from the tubular coil to the connection pad.

A system for electrically coupling a three-dimensional structure to asubstantially two-dimensional structure includes the following: Athree-dimensional structure has a plurality of conductive membersextending along a length thereof, said plurality of conductive membersbeing selectively electrically isolated from one another. A dielectricsubstrate is sized and shaped to come in proximity with at least aportion of said three-dimensional structure to mechanically andelectrically couple the conductive members of the three-dimensionalstructure to the dielectric substrate. A connection pad has a connectionmaterial disposed thereon positioned on the dielectric substrate. Theconnection material is for coupling the conductive elements to thedielectric substrate.

The connection pad may be a conductive pad coupled to the dielectricsubstrate, and the connection material is a conductive material disposedon the conductive pad. The three dimensional structure comprises a coilof wire. The three dimensional structure comprises a flex circuit. Thedielectric substrate is a printed circuit board and the connectionmaterial is a solder. The connection pad on the dielectric substrate isformed as a substantially two dimensional structure. The system furthercomprises a heat transfer pad in thermal communication with theconnection pad. The coil of wires includes multiple conductors.

Also, the three-dimensional structure may include at least one innersheath and an outer sheath, with a plurality of wires disposed betweenthe inner and outer sheaths. A hole is cut into the outer sheath at aconnection point where one of the conductive elements within the tube iscoupled to the connection pad with connection material. The wires have aprotective coating that is stripped away in the vicinity of the holethat is cut into the outer sheath. The three-dimensional structure ishollow. The coil of wires further includes tubes which can transmitsemi-solids, particulates, gases, cryogens, and fluids.

Also, a plurality of three-dimensional structures are coupled to asingle two-dimensional structure. A plurality of two-dimensionalstructures are coupled to a single three-dimensional structure. Thetwo-dimensional structure is part of a printed circuit board. Connectionpads and connection material are disposed on both sides of the printedcircuit board, with the printed circuit board having a hole disposedtherethrough for receiving the three-dimensional structure such that thethree-dimensional structure is coupled to both sides of the printedcircuit board at the connection pads via the connection material. Thetwo-dimensional structure is part of a printed circuit board have fourcorners, with portions of each corner being cutaway to revealpassageways for receiving the three-dimensional structure therein. Thetwo-dimensional structure is part of a printed circuit board. A grooveis disposed in the printed circuit board for receiving athree-dimensional structure therein.

Each wire 14 is stripped of its insulation at the locations of theconnection pads 20. Connection material 22 attaches the wire 14 to thecontact pad 20. The connection material 22 creates a bump that flowsover the stripped wire 14. As seen in FIG. 38, only one wire 14 isattached to the substrate 12 at a given section.

Two wires 14 can be attached to the substrate 12 on opposing sides ofthe tubular structure 16. By varying the spacing of wire 14 along thetubular structure 16 and hence along the coil 10 and stripping wires 14of their insulation at desired locations, it is possible to attach onlycertain wires 14 at certain locations very easily and very accurately.

In addition to the foregoing, it is also possible to attach wires 14inside a tubular structure 16. A small substrate 12 is placed within thetubular structure 16. The substrate 12 has connection pads 20 withconnection material 22 formed thereon. Wires 14 can then be attached tothe substrate 12 using any known method.

The coil 10 may be comprised of a flat flexible substrate (not shown)upon which is disposed a conductive material such that there are exposedareas and covered areas along the conductive materials path. The end ofthe flexible material is folded under itself, exposing the exposedconductive material all along the outside of radius. With the exposedconductive material displayed in such a manner, it becomes very easy toboth mechanically and electrically attach flexible material toconnection pad with conductive material. The conductive path thus formedcan be easily used to connect components 30 to the coil 10 withconductive material disposed on substrate.

It is not necessary to connect the coil 10 to something directly onsubstrate 12. Specifically, substrate 12 can be so configured such thatmounting pads 32 match corresponding pads on either another substrate 12or a Flex Circuit, or even Pogo Pins.

A substrate 12 can become a connector in and of itself. When a pluralityof pins protrude through or from one of the surfaces of the substrate 12and are in electrical communication with conductive material, then pinscan be easily arranged in such a fashion as to mate with a receptaclethat can then carry an electric current to another device or devices. Itis to be understood that the previous three examples are just that:examples; and that the underlying termination technology can be expandedand incorporated into other electrical and electromechanical devices.

The term “substantially” is used herein as a term of estimation.

It will be appreciated by those of ordinary skill in the art that theconcepts and techniques described herein can be embodied in variousspecific forms without departing from the essential characteristicsthereof. The presently disclosed examples are considered in all respectsto be illustrative and not restrictive. The scope of the invention isindicated by the appended claims, rather than the foregoing description,and all changes that come within the meaning and range of equivalentsthereof are intended to be embraced.

1. A method for transporting a fluid, gas, semi-solid, cryogen,particulate matter, or combinations thereof, between a three dimensionalstructure and a substantially two dimensional structure, comprising:providing a hollow member having a removable material disposed therein,said hollow member associated with a three-dimensional structureassociated with an electrically conductive element, a fluidicallyconductive element, or a combination thereof; associating the hollowmember with a hollow transfer passage of a substantially two-dimensionalstructure; covering the hollow member, and at least one of thetwo-dimensional structure and the three-dimensional structure with asubstance; removing the removable material to define a passage incommunication with the hollow transfer passage of the substantiallytwo-dimensional structure and the hollow member of the three-dimensionalstructure through the substance.
 2. The method of claim 1, furthercomprising: removing part of the hollow member to expose the removablematerial before applying the substance; and associating the exposedremovable material of the hollow member to the hollow transfer passageof a substantially two-dimensional structure, wherein the substance isutilized to cover the exposed removable material defines a passagebetween the hollow member and the hollow transfer passage.
 3. The methodof claim 1, wherein the substantially three-dimensional structure iscoupled to one or more dielectric substrates, with a fluid passagedefined through the dielectric substrates in communication with thehollow transfer passage; and further comprising transporting a fluid,gas, semi-solid, cryogen, particulate matter, or combinations thereof,from the hollow member, through the substance, through the hollowtransfer passage, to the fluid passage.
 4. A system for transporting afluid, gas, semi-solid, cryogen, particulate, or combinations thereof,and for establishing a fluidic or hollow connection between twostructures comprising: a three dimensional structure having a pluralityof conductive elements associated therewith, said conductive elementseach having a channel for transporting materials therealong; a removablematerial disposed within the channel of the conductive elements andcoupled to the substantially two-dimensional structure, the removablematerial being covered with a substance such that when the material isremoved, a hollow transfer passage is defined, wherein the substancemechanically connects one of the conductive passageways in thesubstantially two-dimensional structure to the passageways in thethree-dimensional structure.
 5. The system of claim 4, wherein thetwo-dimensional structure can contain multiple layers for the transferof multiple media and materials.
 6. The system of claim 4, wherein thethree dimensional structure further comprises conductive elements thathave a conductive member disposed therein for establishing an electricalconnection with the two-dimensional structure.
 7. A system forelectrically coupling a three dimensional structure to a substantiallytwo-dimensional structure comprising: a three-dimensional conductivestructure; a substantially two-dimensional conductive structure; meansfor electrically coupling the substantially two dimensional conductivestructure to the three-dimensional conductive structure along anattached section while maintaining flexibility of the three-dimensionalstructure and promoting mechanical retention of the three dimensionalstructure to the two dimensional structure.
 8. The system of claim 7,wherein the three-dimensional conductive structure is tubular and thetwo-dimensional structure has a passageway defined therein for acceptingat least part of the three-dimensional conductive structure.
 9. A systemfor electrically coupling a three dimensional structure to asubstantially two-dimensional structure comprising: a tubular coil ofconductive elements that are selectively electrically isolated from oneanother; a dielectric substrate sized and shaped to come into proximitywith at least a portion of the tubular coil; and a connection pad havinga connection material disposed thereon positioned on the dielectricsubstrate, the connection material for coupling the conductive elementsto the dielectric substrate.
 10. The system of claim 9, wherein theconnection pad is a conductive contact pad coupled to a surface of thedielectric substrate and the connection material is a thermallyactivated conductive connection material for coupling a conductiveelement from the tubular coil to the connection pad.
 11. A system forelectrically coupling a three-dimensional structure to a substantiallytwo-dimensional structure comprising: a three-dimensional structurehaving a plurality of conductive members extending along a lengththereof, said plurality of conductive members being selectivelyelectrically isolated from one another; a dielectric substrate sized andshaped to come in proximity with at least a portion of saidthree-dimensional structure to mechanically and electrically couple theconductive members of the three-dimensional structure to the dielectricsubstrate; and a connection pad having a connection material disposedthereon positioned on the dielectric substrate, the connection materialfor coupling the conductive elements to the dielectric substrate. 12.The system of claim 11, wherein the connection pad is a conductive padcoupled to the dielectric substrate and the connection material is aconductive material disposed on the conductive pad.
 13. The system ofclaim 11, wherein the three dimensional structure comprises a coil ofwires.
 14. The system of claim 11, wherein the three dimensionalstructure comprises a flex circuit.
 15. The system of claim 11, whereinthe dielectric substrate is a printed circuit board and the connectionmaterial is a solder.
 16. The system of claim 11, wherein the connectionpad on the dielectric substrate is formed as a substantially twodimensional structure.
 17. The system of claim 11, further comprising aheat transfer pad in thermal communication with the connection pad. 18.The system of claim 13, wherein the coil of wires comprises multipleconductors.
 19. The system of claim 11, wherein the three-dimensionalstructure comprises at least one inner sheath and an outer sheath, witha plurality of wires disposed between the inner and outer sheaths, witha hole being formed into the outer sheath at a connection point whereone of the conductive elements within the tube is coupled to theconnection pad with connection material, said wires having a protectivecoating that is removed in the vicinity of the hole that has been formedin the outer sheath.
 20. The system of claim 11, wherein thethree-dimensional structure is hollow.
 21. The system of claim 11,wherein the coil of wires further comprises tubes which can transmitsemi-solids, particulates, gases, cryogens, fluids, and combinationsthereof.
 22. The system of claim 11, wherein a plurality ofthree-dimensional structures are coupled to a single two-dimensionalstructure.
 23. The system of claim 11, wherein a plurality oftwo-dimensional structures are coupled to a single three-dimensionalstructure.
 24. The system of claim 11, wherein the two-dimensionalstructure is part of a printed circuit board, and connection pads andconnection material are disposed on both sides of the printed circuitboard, with the printed circuit board having a hole disposedtherethrough for receiving the three-dimensional structure such that thethree-dimensional structure is coupled to both sides of the printedcircuit board at the connection pads via the connection material. 25.The system of claim 11, wherein the two-dimensional structure is part ofa printed circuit board having four corners, with portions of eachcorner being cutaway to reveal passageways for receiving thethree-dimensional structure therein.
 26. The system of claim 11, whereinthe two-dimensional structure is part of a printed circuit board, and agroove is disposed in the printed circuit board for receiving athree-dimensional structure therein.
 27. The system of claim 4, whereinthe three-dimensional structure contacts a plurality of two-dimensionalstructures.
 28. The system of claim 11, wherein a plurality ofthree-dimensional structures couple to a plurality of two-dimensionalstructures.
 29. A method for electrically coupling a three-dimensionalstructure to a substantially two-dimensional structure comprises:providing the system of claim 7, positioning the three-dimensionalstructure in the vicinity of the two-dimensional structure; coupling thetwo dimensional structure to the three-dimensional structure forcommunication of the elements therebetween.
 30. A method forelectrically coupling a three-dimensional structure to a substantiallytwo-dimensional structure comprises: providing the system of claim 9,positioning the three-dimensional structure in the vicinity of thetwo-dimensional structure; coupling the two dimensional structure to thethree-dimensional structure for communication of the elementstherebetween.
 31. A method for electrically coupling a three-dimensionalstructure to a substantially two-dimensional structure comprises:providing the system of claim 11, positioning the three-dimensionalstructure in the vicinity of the two-dimensional structure; coupling thetwo dimensional structure to the three-dimensional structure forcommunication of the elements therebetween.